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sanken electric co., ltd. http://www.sanken-ele.co.jp/en/ SPF7302 description the SPF7302 is a fully protected, single chip full-bridge driver ic for dc brush motor applications. the various protection circuits integrated are: overvoltage protection (ovp); overcurrent protection (ocp) with latch, which is adapted to the dmosfets in each full bridge; undervoltage lockout (uvlo); open load detection; and overcurrent limitation. the package is a thermally enhanced 16-pin hsop power package with an exposed thermal pad on the bottom side of the package. features and benefits supply voltage, v bb , 36 v maximum maximum dc current 3 a continuous, 6 a pulsed (1 khz, duty cycle < 1%, pulse width < 10 s) r ds(on) = 300 m maximum, at t j = 125oc operation modes: forward, reverse, brake (high- or low- side freewheeling current circulation) output disable pin (di pin) protections: overvoltage protection (ovp), 36 v minimum overcurrent protection (ocp), 3 a typical overcurrent limitation (ocl), 6 a typical externally adjustable delay timer to halt ocl thermal shutdown protection (tsd), 151c minimum undervoltage lockout on v bb (uvlo), 4.2 v minimum open load detection at startup diagnosis output linked to ovp, ocp, tsd, uvlo, and open load detection, at startup and in operation full bridge dc motor driver functional block diagram package: 16 pin hsop with exposed thermal pad and tabs not to scale open circuitdetection diag out1 vbb v bb vbb out2 open circuitdetection low-sidegate driver high-sidegate driver with ovp low-sidegate driver low-sideocp low-sideocl high-sideocp high-sideocl pre-regulator in1in2 di diagnostics ovpuvlo tsd in1in2 di high-sidegate driver with ovp diag diag v ref diag diag diag diag diag cp hs1 hs2 ls1 ls2 vbb vbb pgnd pgnd lgnd dly diag SPF7302 downloaded from: http:///
2 sanken electric co., ltd. SPF7302ds full bridge dc motor driver SPF7302 selection guide part number package packing SPF7302 thermally enhanced surface mount (hsop), 16-pin minimum quantity 1400 pieces all performance characteristics given are typical values for circuit or system baseline design only and are at the nominal operating voltage and an ambient temperature, t a , of 25c, unless oth er wise stated. number name description 1 lgnd logic gnd 2 in2 input pin 2 3 in1 input pin 1 4 di disable pin 5 vbb supply input voltage 6 vbb supply input voltage 7 out2 output 2 8 pgnd power gnd 9 pgnd power gnd 10 out1 output 1 11 vbb supply input voltage 12 vbb supply input voltage 13 cp charge pump capacitor pin 14 dly overcurrent limitation delay setting input pin 15 diag diagnostics output pin 16 lgnd logic gnd terminal list table pin-out diagram 12 3 4 5 6 7 8 1615 14 13 12 11 10 9 lgnddiag dly cp vbb vbb out1 pgnd lgnd in2in1 di vbbvbb out2 pgnd absolute maximum ratings at t a = 25c characteristic symbol notes rating unit supply voltage v bb C0.3 to 36 v in1, in2, di, and dly pin input voltage v x C0.3 to 6 v output current i o 3 a i opeak continuous: 1 khz, duty cycle <1%; pulse: < 10 s 6 a diag pin output voltage v diag C0.3 to 6 v diag pin input current i diag diag pin sink current C2 ma cp pin voltage v cp C0.3 to 36 v power dissipation p d1 with infinite heatsink 39 w p d2 mounted on glass epoxy pcb, 50 mm 74 mm 1.6 mm; 0.5 oz copper (18 m thick) exposed copper area 4 junction temperature t j C40 to 150 oc operating ambient temperature t a C40 to 105 oc storage temperature t stg 40 to 150 oc thermal resistance, junction to case r jc mounted on glass epoxy pcb, 50 mm 74 mm 1.6 mm; 0.5 oz copper (18 m thick) exposed copper area 3.2 c/w thermal resistance, junction to ambient r ja 31 c/w downloaded from: http:///
3 sanken electric co., ltd. SPF7302ds full bridge dc motor driver SPF7302 electrical characteristics 1 valid at t j = C30c to 125c, v bb = 14 v, v di = 5 v, c cp = 47 nf, r diag = 5.1 k , unless otherwise specified characteristic symbol test conditions min. typ. max. unit supply voltage v bb 6 C 18 v outx pin leakage current i leakhs C1 C C ma i leakls CC1m a dmosfet on resistance r ds(on_1h i out = 1 a C C 300 m r ds(on)_2h i out = 3 a C C 300 m r ds(on)_1l i out = 1 a C C 300 m r ds(on)_2l i out = 3 a C C 300 m dmosfet body diode forward voltage v f_h1 i out1 = 1 a C 1.0 2.0 v v f_h2 i out2 = 1 a C 1.0 2.0 v v f_l1 i out1 = C1 a C 1.0 2.0 v v f_l2 i out2 = C1 a C 1.0 2.0 v quiescent current i bb C7Cm a overcurrent limit (ocl) i ocl_h1 t j = C40c to 150c, i ocl < i ocp ; guaranteed by design 2.0 3.0 4.5 a i ocl_h2 2.0 3.0 4.5 a i ocl_l1 2.0 3.0 4.5 a i ocl_l2 2.0 3.0 4.5 a overcurrent protection (ocp) i ocp_h1 t j = C40c to 150c, i ocl < i ocp ; guaranteed by design 4.5 6.0 8.0 a i ocp_h2 4.5 6.0 8.0 a i ocp_l1 4.5 6.0 8.0 a i ocp_l2 4.5 6.0 8.0 a in1, in2, di, and dly pin input voltage v x_h 3.0 C 5.3 v v x_l C0.3 C 1.5 v in1, in2, di, and dly pin input current i x_h v dly = 5 v C 100 200 a i x_l v dly = 0 v C1 C 1 a diag pin output voltage v diag_h v cc = 5 v 4.0 C C v v diag_l i sink = 2 ma C C 0.4 v diag pin output current i diag_h v cc = 5 v, diag pin source current C250 C C a i diag_l v cc = 5 v, diag pin sink current, v diag = 2 v C C 3 ma in1 and in2 pin input propagation time t inx_on delay from v inx = 2 v v outx 0.2 C 7 15 s t inx_off delay from v inx = 1.5 v v outx 0.8 C 7 15 s output rise time t rx delay from v outx = 20% 80% points, at i outx = 1 a C 0.5 2 s output fall time t fx delay from v outx = 20% 80% points, at i outx = 1 a C 0.5 2 s continued on the next page downloaded from: http:///
4 sanken electric co., ltd. SPF7302ds full bridge dc motor driver SPF7302 dly pin threshold voltage v dly(th) overcurrent limitation (ocl) activating voltage 1.4 1.6 1.8 v dly pin sourcing current 2 i dly 15 30 60 a uvlo releasing voltage v uvlo_off C C 5.2 v uvlo activating voltage v uvlo_on 4.2 C C v uvlo hysteresis v uvlohys C 0.2 C v ovp protection activating voltage v ovp_on 36 C 42 v ovp protection releasing voltage v ovp_off 32 C 38 v ovp hysteresis v ovphys C5C v thermal shutdown activating temperature 3 t tsd_on starts at 165c typical; guaranteed by design 151 165 C oc thermal shutdown releasing temperature 3 t tsd_off guaranteed by design 136 150 C oc thermal shutdown hysteresis 3 t tsdhys guaranteed by design C 15 C oc 1 the parameters at t j = C40oc to 150oc are specified by design. the actual production tests are done at 25oc and 125oc. 2 the individual overcurrent limitation of each dmosfet is masked during the delay period. therefore, ensure proper thermal design for dissipating transient temperature increase caused by current during this period.3 tsd (thermal shutdown protection starts at 165oc typical, and it is specified by design. electrical characteristics 1 (continued) valid at t j = C30c to 125c, v bb = 14 v, v di = 5 v, c cp = 47 nf, r diag = 5.1 k , unless otherwise specified characteristic symbol test conditions min. typ. max. unit motor control truth table 1 reference number status input output dmosfet status di in1 in2 out1 out2 diag hs1 ls1 hs2 ls2 1 forward rotation 2 h h l h l h on off off on 2 reverse rotation 2 h l h l h h off on on off 3 low-side freewheeling h l l l l h off on off on 4 high-side freewheeling h h h h h h on off on off 5 output disabled l x x z z h off off off off 6 overcurrent limitation (ocl) active (hs1) h h x h x h on off x x 7 overcurrent limitation (ocl) active (hs2) h xhxhhxxo no f f 8 overcurrent limitation (ocl) active (ls1) h l x l x h off on x x 9 overcurrent limitation (ocl) active (ls2) h x l x l h x x off on 10 overcurrent protection with latch (ocp) active (hs1) h h x z z l off off off off 11 overcurrent protection with latch (ocp) active (hs2) h x h z z l off off off off 12 overcurrent protection with latch (ocp) active (ls1) h l x z z l off off off off 13 overcurrent protection with latch (ocp) active (ls2) h x l z z l off off off off 14 undervoltage lockout (uvlo) protection active x x x z z l off off off off 15 overvoltage protection (ovp) active x x x x x l xxxx 16 open load detected at startup l x x x x l off off off off 17 open load detected in operation h x x x x l xxxx 18 thermal shutdown protection (tsd) active x x x z z l off off off off 1 x is "don't care," z is high impedance. 2 "forward" and "reverse" only indicate opposite relative direction. downloaded from: http:///
5 sanken electric co., ltd. SPF7302ds full bridge dc motor driver SPF7302 inx v inx_h v inx_l outx t inx_on v outx 0.2 v outx 0.8 t inx_off switching operation timing charts figure 1. output delay time figure 2. output switching time outx v outx 0.2 v outx 0.8 t fx t rx downloaded from: http:///
6 sanken electric co., ltd. SPF7302ds full bridge dc motor driver SPF7302 1.00.8 0.6 0.4 0.2 0 0123 0123 vbb to outx (v) 12 84 0 01 02 03 04 0 high-side dmosfet r ds(on) low-side dmosfet r ds(on) high-side dmosfet r ds(on) low-side dmosfet r ds(on) quiescent currentversus supply voltage cp pin voltageversus supply voltage t a = C40c 25c 150c t a = C40c 25c 150c v cc = 14 v 6 v 5.5 v t a = C40c 25c 150c 1.00.8 0.6 0.4 0.2 0 0123 0123 1.00.8 0.6 0.4 0.2 0 1.00.8 0.6 0.4 0.2 0 i q (ma) v bb (v) i out (a) vbb to outx (v) i out (a) outx to pgnd (v) i out (a) outx to pgnd (v) i out (a) 01 02 03 04 0 v bb (v) v cp (v) 5040 30 20 10 0 v cc = 14 v 6 v 5.5 v characteristic performance t a = 25c unless otherwise specified downloaded from: http:///
7 sanken electric co., ltd. SPF7302ds full bridge dc motor driver SPF7302 1612 84 0 01 3 25 4 1612 84 0 01 3 25 4 vout1 (v) 0.60.5 0.4 0.3 0.2 0.1 0 01 23 di pin thresholdcharacteristics diag output versus di sink current uvlo voltageversus supply voltage t a = C40c 25c 150c t a = C40c 25c 150c 02 8 6 41 0 200100 0 02 8 6 41 0 200100 0 v diag (v) i di(sink) (ma) v di (v) vout1 (v) inx pin thresholdcharacteristics di pin currentcharacteristics inx pin currentcharacteristics v in (v) v di (v) v in (v) i di(sink) ( a) i in(sink) ( a) 0246 v bb (v) v uvlo (v) 64 2 0 t a = C40c 25c 150c downloaded from: http:///
8 sanken electric co., ltd. SPF7302ds full bridge dc motor driver SPF7302 64 2 0 64 2 0 25 30 35 45 40 100 140 120 180 160 v diag (v) v diag (v) diag outputvoltage with ovp activated (ic continues operation) diag outputvoltage with tsd activated (ic stops operation) output rise time, t rx output fall time, t fx v inx = 2 v/div t = 2 s/div v outx = 2 v/div 160 ns v bb (v) input to output on propagation delay, t inx_on v inx = 2 v/div t = 2 s/div v outx = 2 v/div v inx = 2 v/div t = 50 ns/div v outx = 2 v/div v inx = 2 v/div t = 100 ns/div v outx = 2 v/div input to output off propagation delay, t inx_off t j (c) 140 ns 7.9 s 7.8 s downloaded from: http:///
9 sanken electric co., ltd. SPF7302ds full bridge dc motor driver SPF7302 dly voltageversus inx pin voltage i outx = 1 a/div t = 100 s/div v outx = 10 v/div high-side dmosfetocl operation example low-side dmosfetocl operation example high-side dmosfetocp operation example low-side dmosfetocp operation example t = 100 s/div v outx = 10 v/div i outx = 2 a/div v inx = 5 v/div t = 10 s/div v dly = 0.5 v/div 1.6 v 3.4 a 6.9 a t = 100 s/div v outx = 10 v/div i outx = 2 a/div 7.1 a i outx = 1 a/div t = 100 s/div v outx = 10 v/div 4.0 a downloaded from: http:///
10 sanken electric co., ltd. SPF7302ds full bridge dc motor driver SPF7302 figure 4. open load detectionfigure 5. delay to open load protection activation versus value of external capacitor on the output pins vbb v uvlo_off v uvlo_on v bb C 2 v di vout1 diag v di_h (threshold) a b c 0.01 0.1 1 10 100 1000 0.001 0.01 0.1 1 maximum typic al capacitance of filter capacitor on vout1 ( f) open load detection delay time versus output filtering capacitance v bb = 14 v minimum delay (ms) figure 3. behavior of current limitation and overcurrent protection function 6 a (typ.) overcurrent 3a (typ.) current limit 3 s (typ.) protection function operation current limitation and overcurrent protection the overcurrent limit is adapted to each dmosfet, and is acti- vated when the drain current reaches 3 a typical. after that, it is followed by a 3 s typical off-time, and then it restarts automati- cally. overcurrent protection is activated when the drain current reaches 6 a typical within 3 s, as shown in figure 3. it shuts down the ic in a latch mode. setting the di pin to logic low level resets the internal logic circuit and releases the latch. diag pin and open load detection behavior open load detection does not operate until after the output volt- age of out1 (v out1 ) reaches about v bb C 2 v. if an open load is detected, the diag signal goes high. the process of open load detection is shown in figure 4: a. during this period, uvlo is activated and diag stays low. b. if a filtering capacitor is used at the outputs, it causes a delay of open load detection. (refer to figure 5 for the relationship of the delay versus the filtering capacitor value.) c. the open load detection period starts functioning. raising di input above v di_h (threshold), that is, by activating the ic, clears the diag signal. therefore, the open load condition must be checked before the time of that event. downloaded from: http:///
11 sanken electric co., ltd. SPF7302ds full bridge dc motor driver SPF7302 ocl deactivated ocp activated 3 a (typ.) current limit di dly inx i outx v inx (threshold) v dly(th) di outx 2.5 s inx diag outx diag diag (high) normal operation at open load a a a v di_h (threshold) open load detection during normal operation of the ic is done by checking the negative potential of the output. referring to figure 6, during normal operation, recirculation current causes the output to be below gnd. the ic checks the output voltage during 2.5 s typical, just after the falling edge of the corresponding in signal, and if it does not detect the negative potential, diag is asserted after the 2.5 s detection period. during the 2.5 s period, the diag pin is set to high because the internal circuit is reset during that period (see the arrows marked a in figure 6). open load detection operates differently during startup of the ic. the overcurrent limitation deactivated period occurs imme- diately after di is asserted. therefore, in order to repeat ocl deactivation, recycle di. during this period, overcurrent protection (ocp) is still active. (with regard to ocl delay, see also note 2 to the electrical characteristics table.) figure 6. open load detection in normal operation figure 7. dly pin effect at startup downloaded from: http:///
12 sanken electric co., ltd. SPF7302ds full bridge dc motor driver SPF7302 application information figure 8. typical application circuit. recommended components are: figure 9. recommended solder pad layout, dimensions in mm c cp 48 nf c dly 0.1 f r diag 3.3 k 4.6 12.5 1.75 0.87 pin 16 pin 1 0.40 2.2 out1 vbb out2 in1in2 di cp v cc c dly c cp pgnd lgnd SPF7302 dly diag r diag m c in downloaded from: http:///
13 sanken electric co., ltd. SPF7302ds full bridge dc motor driver SPF7302 thermal design figure 10. power dissipation derating curve 4540 35 03 25 20 15 10 50 C40 C20 0 20 40 60 80 100 120 140 160 with infinite heatsink ambient temperature, t a (c) power dissipation, p d (w) mounted on 1000 mm 2 pcb exposed copper areathickness 18 m figure 12. test pcb land pattern 6050 40 30 20 10 0 10 100 1000 copper area (mm 2 ) r q ja (c/w) 10000 100000 exposed copper areathickness 18 m figure 11. thermal resistance versus pcb copper area approximate power dissipation, p d , in normal operation is calculated by equation 1, and the junction temperature, t j , is estimated by equation 2 or 3. figure 13 shows example data of ? t j versus p d . note: a final thermal evaluation should be done under actual application conditions, taking into account actual pcb and load conditions. p d v bb ? i bb1 ? (v sath ? v satl ) ? i om ? d on ? (v satl(h) ? v f ) ? i om ? d off (1) where: v bb is the supply voltage (battery voltage), i bb1 is the circuit current during operation, v sath is the high-side saturation voltage, v satl is the low-side saturation voltage, v f is the freewheeling diode forward voltage, i om is the motor current, d on is the in1 and in2 duty cycle (proportion on) , and d off is the in1 and in2 proportion off (d on + d off = 100%). to calculate t j : t j = r ja p d + t a (2) or t j = t p + r jc (3.2c/w) p d (3) where: r ja can be obtained from figure 11, and t p is the temperature at the exposed thermal pad of the device. figure 13. thermal performance 125100 7550 25 0 0123 p d (w) ? t j (c) 45 ? t ja on pcb with exposed copper area = 1000 mm 2 ? t jc downloaded from: http:///
14 sanken electric co., ltd. SPF7302ds full bridge dc motor driver SPF7302 package outline drawing, 16 pin hsop branding codes (exact appearance at manufacturer discretion):1st line, type: SPF7302 2nd line, lot: ymdd where: y is the last digit of the year of manufacture m is the month ( 1 to 9, o, n, d ) dd is the date package: hsop-16dimensions in millimeters 21 16 10.5 0.2 12.2 0.2 7.50 0.2 2 0.2 1 0.3 1.35 0.2 10.5 0.3 2.5 0.2 0.25 +0.15?0.05 0.1 0 0.4 +0.15?0.05 8 0 (3.05) (4.7) 1.270.25 brandingarea exposed thermal pad tab from exposed thermal pad xxxxxxxxxxxxxxxx view a enlargement view a (8.89) ( ? 0.8) a leadframe plating pb-free. device composition complies with the rohs directive. downloaded from: http:///
15 sanken electric co., ltd. SPF7302ds full bridge dc motor driver SPF7302 90 to 12 0s 30s 60s 24 5 2 30 2001 50 temperature (oc) d u r at i o n (s) 4 oc/s solder reflow profile because reliability can be affected adversely by improper storage environments and handling methods, please observe the following cautions. cautions for storage ensure that storage conditions comply with the standard temperature (5c to 35c) and the standard relative humidity (around 40% to 75%); avoid storage locations that experience extreme changes in temperature or humidity. avoid locations where dust or harmful gases are present and avoid direct sunlight. reinspect for rust on leads and solderability of the products that have been stored for a long time. cautions for testing and handling when tests are carried out during inspection testing and other standard test periods, protect the products from power surges from the testing device, shorts between the product pins, and wrong connections. ensure all test parameters are within the ratings specified by sanken for the products. soldering when soldering the products, please be sure to minimize the working time, and any soldering iron should be kept at a distance from the body of the product. the number of reflow procedures is restricted to two only. device reliability and appearance are guaranteed within the temperature profile below, after storage conditions of up to 168 hours at t a = 85oc and rh = 85%. electrostatic discharge when handling the products, the operator must be grounded. grounded wrist straps worn should have at least 1 m of resistance from the operator to ground to prevent shock hazard, and it should be placed near the operator. workbenches where the products are handled should be grounded and be provided with conductive table and floor mats. when using measuring equipment such as a curve tracer, the equipment should be grounded. when soldering the products, the head of soldering irons or the solder bath must be grounded in order to prevent leak voltages generated by them from being applied to the products. the products should always be stored and transported in sanken shipping containers or conductive containers, or be wrapped in aluminum foil. downloaded from: http:///
16 sanken electric co., ltd. SPF7302ds full bridge dc motor driver SPF7302 the contents in this document are subject to changes, for improvement and other purposes, without notice. make sure that this is the latest revision of the document before use. application and operation examples described in this document are quoted for the sole purpose of reference for the use of the prod- ucts herein and sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or any other rights of sanken or any third party which may result from its use. although sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semicon- ductor products at a certain rate is inevitable. users of sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device failure or malfunction. sanken products listed in this document are designed and intended for the use as components in general purpose electronic equip- ment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). when considering the use of sanken products in the applications where higher reliability is required (transportation equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest sanken sales representative to discuss, prior to the use of the products herein. the use of sanken products without the written consent of sanken in the applications where extremely high reliability is required (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited. in the case that you use sanken products or design your products by using sanken products, the reliability largely depends on the degree of derating to be made to the rated values. derating may be interpreted as a case that an operation range is set by derating the load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. in general, derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stresses such as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor products. for these stresses, instantaneous values, maximum values and minimum values must be taken into consideration. in addition, it should be noted that since power devices or ic's including power devices have large self-heating value, the degree of derating of junction temperature affects the reliability significantly. when using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance and proceed therewith at your own responsibility. anti radioactive ray design is not considered for the products listed herein. sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of sanken's distribu- tion network. the contents in this document must not be transcribed or copied without sanken's written consent. downloaded from: http:///

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